Three 14-pin (DIP14) plastic dual in-line packages containing IC chips. 13.4 Packages with more than six terminals.13.1.5 Metal electrode leadless face (MELF).9 Transistor, diode, small-pin-count IC packages.Assemblies using "bare" chips have additional packaging or filling with epoxy to protect the devices from moisture. In beam-lead technology, the metallized pads that would be used for wire bonding connections in a conventional chip are thickened and extended to allow external connections to the circuit. In flip chip systems the IC is connected by solder bumps to a substrate. Occasionally specially-processed integrated circuit dies are prepared for direct connections to a substrate without an intermediate header or carrier. Integrated circuit packaging is the last assembly process before testing and shipping devices to customers. Other types are proprietary designations that may be made by only one or two manufacturers. Some package types have standardized dimensions and tolerances, and are registered with trade industry associations such as JEDEC and Pro Electron. A very large number of different types of package exist. Integrated circuits are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect the devices from damage. A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC.
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